Product overview
- Part Number
- FW-02-03-L-D-260-065
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Documents & Media
- Datasheets
- FW-02-03-L-D-260-065
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 4 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 4 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- FW-SM
- Stack Height :
- 6.6 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
400KXW120MEFC16X35
100RX30470M18X31.5
70HRX560M16X23
UPM2D101MHD
EGPD250ELL272MU20H
25HGX2000M16X23
63YXG1500MEFC18X40
160TXW390MEFR18X30
400QXW150MEFR18X31.5
420BXW100MEFR16X40
400CXW150MEFR18X31.5
25PX10000MEFC18X35.5
UVR2C331MRD6
EGPD630ELL681ML20H
450PX100MEFC18X40
400TXW120MEFR18X35
ELXZ6R3ELL103MM25S
UAS2D181MHD6TN
ULD2W330MHD6
220TXW330MEFR18X35