Product overview
- Part Number
- TW-03-03-L-D-170-SM
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Documents & Media
- Datasheets
- TW-03-03-L-D-170-SM
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 4.9 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 6 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 2 mm
- Product :
- Headers
- Series :
- TW
- Stack Height :
- 4.32 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
50CBPT45-01B08N
50CBPT45-01A08N
50CPT60-01B06N
51S30-01-2-06S
50CT90-01B04N
50CBT60-01B04N
50CBT60-01A06N
50CT60-01B06N
50MPT36-01B07N
50MT36-01-1-02S
50MPT36-01B08N
50MPT36-01B04N
51CT30-01-1-02N
50MT36-01B10N
50MT36-01-1-10N
50MT36-01-1-06N
50MT36-01-1-08N
50MBT36-01B08N
51CBT30-01B02N
50MP60-01-1-06N