Product overview
- Part Number
- CLP-108-02-L-DH
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documents & Media
- Datasheets
- CLP-108-02-L-DH
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Right Angle
- Number of Positions :
- 16 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Description
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
CXB2530-0000-000N0BV465E
CMT2850-0000-000N0U0A30Q
XPLBWT-00-0000-000UV240G
CXB1830-0000-000N0UU240H
XPLBWT-00-0000-000UU535G
XBHAWT-00-0000-000LT50E4
XPLBWT-00-0000-000UU327G
XPLAWT-00-0000-000PU30F8
MHBBWT-0000-000N0BE250E
XBHAWT-00-0000-0000T50C4
CMT2850-0000-000N0U0A30U
XPGBWT-H1-0000-00HE7
XPGBWT-01-0000-00LF5
XPLBWT-00-0000-000HV40E5
CXB1830-0000-000N0UT227G
CXB2530-0000-000N0BV450E
XPGBWT-U1-0000-00BZ7
XPLBWT-00-0000-000HV30E6
XPGWHT-H1-0000-00AE8
MHBBWT-0000-000N0BE257E