Product overview
- Part Number
- TW-08-03-G-D-330-SM-A
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Documents & Media
- Datasheets
- TW-08-03-G-D-330-SM-A
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 4.9 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 16 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 2 mm
- Product :
- Headers
- Series :
- TW
- Stack Height :
- 8.38 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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