Product overview
- Part Number
- CLP-103-02-L-DH-TR
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documents & Media
- Datasheets
- CLP-103-02-L-DH-TR
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Right Angle
- Number of Positions :
- 6 Position
- Number of Rows :
- 2 Row
- Packaging :
- Cut Tape, MouseReel, Reel
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Description
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
FGA.2B.304.CLAD72Z
FGB.2B.304.CLAD62
FFA.1Y.405.CLAC27
FGG.1K.304.CLAK85
FFA.1Y.405.CLAC52
HEU.MM.304.XLNP
EXG.1B.304.HLNS
EGG.2T.312.CLL
FCG.1B.306.CLAD76
PGZ.2S.307.CLLD82
FGG.2B.307.CLAD62
FGG.2B.307.CLAD62Z
FGG.1K.308.CYCC40
FDG.1B.307.CLAD42Z
EPL.1S.306.HLN
EXB.0B.307.HLN
FGG.2B.305.CYCD82
FGG.1K.310.CLAC65Z
FGG.1B.314.CLAD62
FGG.2B.308.CYCD82Z