Datasheets

SEAFP-20-01-L-08-RA-WT-GP

Contact Material :

Beryllium Copper

Contact Plating :

Gold

Current Rating :

1.9 A

Housing Material :

Liquid Crystal Polymer (LCP)

Maximum Data Rate :

16 Gbps

Mounting Angle :

Right Angle

Number of Positions :

160 Position

Number of Rows :

8 Row

Packaging :

Tray

Pitch :

1.27 mm

Product :

Sockets

Series :

SEAFP-RA

Termination Style :

Solder

Voltage Rating :

255 VAC