Product overview
- Part Number
- LPAM-30-01.0-L-08-2-K-TR
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal
Documents & Media
- Datasheets
- LPAM-30-01.0-L-08-2-K-TR
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 2.2 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 28 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 240 Position
- Number of Rows :
- 8 Row
- Packaging :
- Cut Tape, Reel
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- LPAM
- Stack Height :
- 4 mm, 4.5 mm
- Termination Style :
- Crimp
- Voltage Rating :
- 250 VAC
Description
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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