Datasheets

294032

Contact Material :

Copper Alloy

Contact Plating :

Gold

Current Rating :

2.3 A

Housing Material :

Liquid Crystal Polymer (LCP)

Maximum Data Rate :

3 Gb/s

Maximum Operating Temperature :

+ 125 C

Minimum Operating Temperature :

- 55 C

Mounting Angle :

Vertical

Number of Positions :

80 Position

Number of Rows :

2 Row

Pitch :

0.8 mm

Product :

Headers

Series :

MicroCon

Stack Height :

8 mm

Termination Style :

Solder