- Manufacturer:
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- CUI Devices (2)
- Wakefield-Vette (27)
- Mounting Style:
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- Height:
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- Designed for:
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- Heatsink Material:
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- Fin Style:
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- Thermal Resistance:
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- Selected conditions:
64 Records
Image | Part Number | Manufacturer | Description | Price | Stock | Operation |
---|---|---|---|---|---|---|
Advanced Thermal Solutions | Heat Sinks maxiGRIP Ass... |
|
46
MOQ:1
INC:1
|
Get quote Add to cart | ||
CUI Devices | Heat Sinks heat sink, BGA... |
|
1,513
MOQ:1
INC:1
|
Get quote Add to cart | ||
CUI Devices | Heat Sinks heat sink, BGA... |
|
660
MOQ:1
INC:1
|
Get quote Add to cart | ||
Wakefield-Vette | Heat Sinks Chipset Heat S... |
|
468
MOQ:1
INC:1
|
Get quote Add to cart | ||
Aavid, Thermal Division of Boyd Corporation | Heat Sinks Heat Sink for P... |
|
973
MOQ:1
INC:1
|
Get quote Add to cart | ||
Advanced Thermal Solutions | Heat Sinks maxiFLOW maxi... |
|
200
MOQ:1
INC:1
|
Get quote Add to cart | ||
Advanced Thermal Solutions | Heat Sinks fanSINK Asse... |
|
189
MOQ:1
INC:1
|
Get quote Add to cart | ||
Advanced Thermal Solutions | Heat Sinks fanSINK Asse... |
|
193
MOQ:1
INC:1
|
Get quote Add to cart | ||
Aavid, Thermal Division of Boyd Corporation | Heat Sinks BGA Solder A... |
|
3,348
MOQ:1
INC:1
|
Get quote Add to cart | ||
Advanced Thermal Solutions | Heat Sinks High Performanc... |
|
330
MOQ:1
INC:1
|
Get quote Add to cart |